System In Package-SiP

SiP is a functional system or sub-system assembled into a single package. Typically, it will contain two or more dissimilar die. For example, a FPGA, processor, data conveters and flash memories can be combined in one space-saving package.They can also be combined with other components such as sensors, triggers, passives, MEMS, voltage regulators, etc.
These are then assembled on an interposer or substrate to create a customized, integrated product for a specific application. Within the SiP, the designer can utilize bare die (wire bond or flip chip),BGA/CCGA packaged devices, stacked die or stacked packages.The benefits of this technology are:
  · Greater functionality in a time-to-market window that cannot be met through silicon integration; increased density and performance.
  · Reduced board area, weight and routing complexity at the PCB level. Board layer reduction and performance enhancements reduces PCB costs.
  · Design optimization through use of the most costeffective silicon solutions and assembling different semiconductor technologies, die geometries, or chips from
    different fabs in the same package.
  · Value added benefits include high-speed designs, assembly processes and material set incorporated into the SiP.
  · Allows the OEM to upgrade products by using die-shrinks in the same package.
  · Multiple techniques designed specifically for chip level anti-tamper
  · Combining sensors, triggers and encryption to SiP products
  · The Created common platform can be upgraded at any time,and more stable and reliable.